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Aluminum Nitride (AlN)

Article source:admings    Time:2015-07-17

Aluminum Nitride (AlN)

  Aluminum Nitride (AlN) Product Applications

  After molding and sintering process, the aluminum nitride can be used for high power IC, LED chip aluminum nitride carrier plate, high thermal conductive electronic aluminum nitride plate, high thermal conductive co-fired ceramics, high thermal conductive radiation heat sink, metallurgy crucible and wafer microwave plasma process carrier, high-value ceramic shade and cooling mode components.

  Aluminum nitride powder can be mixed with Epoxy, PI, Silicon, acrylic and other materials and refined to composite materials of high thermal conductivity and electrical insulation, which can be used in LED, semiconductor package of high thermal conductive film, hard and soft substrates of high thermal conductivity, aluminum (metal) substrates insulation material, thermal paste (plastic), thermal pads, thermal dissipation protection paint, thermal dissipation printing ink.

  Aluminum Nitride Product Application

  • LED electronic packaging materials

  • Making integrated circuit substrate, electronics, optics, heat sink

  • High-temperature crucible fabrication of metal matrix and polymer matrix composite material

  • Thermal silica and thermal conductive epoxy

  • Nano-lubricants and antiwear agent

  • Application in high thermal conductive plastics

  Aluminum Nitride Product Application (Engineering plastics)

  Once added to engineering plastics, Aluminum nitride can increase the performance and mechanical strength of the engineering plastics, improve the injection molding properties, and enhance its thermal conductivity.

  Aluminum Nitride (AlN) Product Application (thermal conductive material)


Aluminum nitride Substrate




Thermal interface material (TIM)


Thermal silica and conductive plastic, resin application



  Composite materials can meet the requirements of functionality and cost, and at the same time improve the mechanical properties and thermal conductivity and insulation of the composites.

  1. High-priced metal plate such as Cu, Ni can be used in electronics and building materials to meet the requirements of electrical refractory.

  2. Common metals like SECC whose price is about 1/3 of the above metals, can also meet the strength requirements.

  3. In comparison with the original material, the composite metal can significantly reduce the cost of materials

  4. Additional features can be improved, such as cooling, insulation, hardness, weight loss, thinness.
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